Payment gateway provider and EMV migration specialist Creditcall, which has more than 15 years of EMV experience and 1 million EMV Kernels deployed worldwide, recently announced its collaboration with NXP Semiconductors N.V., supplier of contact and contactless interfaces.
Creditcall will combine an “evaluation version” of its EMV Level 2 Contact and Contactless Kernels with NXP’s payment-compliant smart card interfaces. The EMV Kernels are the software components that control communication between an EMV chip card terminal and a contact or contactless EMV chip card.
As a result of the partnership, the two companies plan to offer secure NFC-enabled mPOS solutions. They will also enable PED manufacturers to test the feasibility of using both technologies in their own designs to “dramatically reduce risk, cost and time to market.”
Paul Hubmer, general manager, NFC reader solutions, NXP Semiconductors said in the release that the partnership with Creditcall will give customers “access to an extremely impressive range of contact and contactless EMV Level 2 Kernels.”
“This collaboration is a strategic win for all as it provides a more complete EMV offering to PED manufacturers than has previously existed,” said Jeremy Gumbley, chief technology officer at Creditcall, in the release. “PED manufacturers worldwide now have access to a risk free path to EMV which is faster, easier and more cost effective.”